Tag: Inner circle cutting process
Physical method solar cell polysilicon
Crystal cutting-inner circle cutting process and multi-wire cutting of single crystal silicon
Yanmo Kaifang lays the foundation for the in-depth cutting of crystals, and crystal cutting is to use special equipment such as internal slicers or wire cutting to cut silicon crystals into thin slices that meet the requirements. At the same time, the silicon single crystal wafer used for device production also has certain requirements on … Read More